- Patent Title: Multi-band antenna on the surface of wireless communication devices
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Application No.: US15375814Application Date: 2016-12-12
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Publication No.: US10211512B2Publication Date: 2019-02-19
- Inventor: Wee Kian Toh , Hongwei Liu , Ping Shi
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: FUTUREWEI TECHNOLOGIES, INC.
- Current Assignee: FUTUREWEI TECHNOLOGIES, INC.
- Current Assignee Address: US TX Plano
- Agency: Slater Matsil, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/22 ; H01Q9/04 ; H01Q1/38 ; H01Q5/10 ; H01Q1/42 ; H01Q1/52 ; H01Q9/42 ; H01Q21/28 ; H01Q1/48 ; H01Q5/371

Abstract:
An embodiment wireless communication device includes a circuit board and a cover having a back surface covering a portion of a first surface of the circuit board and an opening in the back surface. A top antenna is disposed within the cover and is electrically connected to the circuit board at a first feed point on a first edge of the circuit board. A secondary antenna disposed within the cover has a first antenna portion connected to the circuit board at a second feed point, and a second antenna portion of the second antenna extends laterally from a second edge of the circuit board over the first surface of the circuit board and between the back surface of the cover and the first surface of the circuit board such that at least a portion of the second antenna portion is exposed through the opening in the back surface.
Public/Granted literature
- US20170093019A1 Multi-band Antenna on the Surface of Wireless Communication Devices Public/Granted day:2017-03-30
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