Invention Grant
- Patent Title: Ion implantation apparatus and ion implantation method
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Application No.: US15695857Application Date: 2017-09-05
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Publication No.: US10217607B2Publication Date: 2019-02-26
- Inventor: Kazuhisa Ishibashi , Shiro Ninomiya , Akihiro Ochi , Toshio Yumiyama
- Applicant: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2016-173935 20160906
- Main IPC: H01J37/30
- IPC: H01J37/30 ; H01J37/304 ; H01J37/317 ; H01L21/265

Abstract:
An ion implantation apparatus includes a beam scanner that provides a reciprocating beam scan in a beam scan direction in accordance with a scan waveform, a mechanical scanner that causes a wafer to reciprocate in a mechanical scan direction, and a control device that controls the beam scanner and the mechanical scanner to realize a target two-dimensional dose amount distribution on a surface of the wafer. The control device includes a scan frequency adjusting unit that determines a frequency of the scan waveform in accordance with the target two-dimensional dose amount distribution, and a beam scanner driving unit that drives the beam scanner by using the scan waveform having the frequency determined by the scan frequency adjusting unit.
Public/Granted literature
- US20180068829A1 ION IMPLANTATION APPARATUS AND ION IMPLANTATION METHOD Public/Granted day:2018-03-08
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