- 专利标题： Light emitting device package, backlight unit, and method of manufacturing light emitting apparatus
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申请号： US15896910申请日： 2018-02-14
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公开(公告)号： US10222539B2公开(公告)日： 2019-03-05
- 发明人: Seung-Hyun Oh , Dae-Gil Jung , Jung-Hyun Park , Hyo-Gu Jeon
- 申请人： LUMENS CO., LTD.
- 申请人地址： KR Yongin-si
- 专利权人： LUMENS CO., LTD.
- 当前专利权人： LUMENS CO., LTD.
- 当前专利权人地址： KR Yongin-si
- 代理机构： Mei & Mark LLP
- 优先权： KR10-2015-0056682 20150422; KR10-2015-0099949 20150714
- 主分类号： G02B6/00
- IPC分类号： G02B6/00 ; H01L33/60 ; H01L33/50 ; F21V8/00 ; H01L33/48 ; H01L33/58
摘要：
Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.
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