公开(公告)号：US10222539B2

公开(公告)日：2019-03-05

申请号：US15896910

申请日：2018-02-14

申请人： LUMENS CO., LTD.

发明人： Seung-Hyun Oh ,  Dae-Gil Jung ,  Jung-Hyun Park ,  Hyo-Gu Jeon

IPC分类号： G02B6/00 ,  H01L33/60 ,  H01L33/50 ,  F21V8/00 ,  H01L33/48 ,  H01L33/58

摘要： Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.

公开(公告)号：US09933560B2

公开(公告)日：2018-04-03

申请号：US15135704

申请日：2016-04-22

申请人： LUMENS CO., LTD.

发明人： Seung-Hyun Oh ,  Dae-Gil Jung ,  Jung-Hyun Park ,  Hyo-Gu Jeon

IPC分类号： H01L33/50 ,  H01L33/60 ,  G02B6/00 ,  F21V8/00 ,  H01L33/48 ,  H01L33/58

CPC分类号： G02B6/0073 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0091 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60

摘要： A light emitting device apparatus is provided. For example, a light emitting device package include a substrate, a light emitting device, a reflection molding member, an upper cover and an interval maintaining part. The substrate includes a first electrode and a second electrode. The light emitting device includes a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode. The reflection molding member includes a form and a reflection cup part. The upper cover is formed in a shale corresponding to that of an upper surface of the reflection molding member, and the interval maintaining part is formed at the upper cover such that a predetermined optical interval is maintained between a light guide plate and the light emitting device.

公开(公告)号：US09748459B2

公开(公告)日：2017-08-29

申请号：US14912366

申请日：2014-08-12

申请人： LUMENS CO., LTD.

发明人： Seung-Hyun Oh ,  Pyoung-Gug Kim ,  Yun-Geon Cho ,  Chun-Ki Min ,  Chul-Yeun Choi ,  Dae-Gil Jung

IPC分类号： H01L33/00 ,  H01L21/50 ,  H01L33/62 ,  H01L33/48 ,  H01L33/64 ,  H01L27/15 ,  H01L33/52

CPC分类号： H01L33/62 ,  H01L27/156 ,  H01L33/486 ,  H01L33/52 ,  H01L33/64 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

摘要： There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed.