公开(公告)号：US09933560B2

公开(公告)日：2018-04-03

申请号：US15135704

申请日：2016-04-22

申请人： LUMENS CO., LTD.

发明人： Seung-Hyun Oh ,  Dae-Gil Jung ,  Jung-Hyun Park ,  Hyo-Gu Jeon

IPC分类号： H01L33/50 ,  H01L33/60 ,  G02B6/00 ,  F21V8/00 ,  H01L33/48 ,  H01L33/58

CPC分类号： G02B6/0073 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0091 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60

摘要： A light emitting device apparatus is provided. For example, a light emitting device package include a substrate, a light emitting device, a reflection molding member, an upper cover and an interval maintaining part. The substrate includes a first electrode and a second electrode. The light emitting device includes a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode. The reflection molding member includes a form and a reflection cup part. The upper cover is formed in a shale corresponding to that of an upper surface of the reflection molding member, and the interval maintaining part is formed at the upper cover such that a predetermined optical interval is maintained between a light guide plate and the light emitting device.

公开(公告)号：US10222539B2

公开(公告)日：2019-03-05

申请号：US15896910

申请日：2018-02-14

申请人： LUMENS CO., LTD.

发明人： Seung-Hyun Oh ,  Dae-Gil Jung ,  Jung-Hyun Park ,  Hyo-Gu Jeon

IPC分类号： G02B6/00 ,  H01L33/60 ,  H01L33/50 ,  F21V8/00 ,  H01L33/48 ,  H01L33/58

摘要： Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.