Invention Grant
- Patent Title: Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germanium
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Application No.: US15536447Application Date: 2015-12-04
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Publication No.: US10227506B2Publication Date: 2019-03-12
- Inventor: Max Siebert , Michael Lauter , Yongqing Lan , Robert Reichardt , Alexandra Muench , Manuel Six , Gerald Daniel , Bastian Marten Noller , Kevin Huang , Sheik Ansar Usman Ibrahim
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: EP14198297 20141216
- International Application: PCT/IB2015/059351 WO 20151204
- International Announcement: WO2016/097915 WO 20160623
- Main IPC: C09G1/04
- IPC: C09G1/04 ; C09G1/02 ; C09K13/00 ; H01L21/304 ; H01L21/461
Abstract:
Disclosed herein is a chemical mechanical polishing (CMP) composition (Q) containing (A) inorganic particles, (B) a compound of general formula (I) below, and (C) an aqueous medium, in which the composition (Q) has a pH of from 2 to 6.
Public/Granted literature
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