公开(公告)号：US10227506B2

公开(公告)日：2019-03-12

申请号：US15536447

申请日：2015-12-04

Applicant: BASF SE

Inventor： Max Siebert ,  Michael Lauter ,  Yongqing Lan ,  Robert Reichardt ,  Alexandra Muench ,  Manuel Six ,  Gerald Daniel ,  Bastian Marten Noller ,  Kevin Huang ,  Sheik Ansar Usman Ibrahim

IPC: C09G1/04 ,  C09G1/02 ,  C09K13/00 ,  H01L21/304 ,  H01L21/461

Abstract: Disclosed herein is a chemical mechanical polishing (CMP) composition (Q) containing (A) inorganic particles, (B) a compound of general formula (I) below, and (C) an aqueous medium, in which the composition (Q) has a pH of from 2 to 6.