Invention Grant
- Patent Title: Interleaving scheme for increasing operating efficiency during high current events on an integrated circuit
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Application No.: US15852814Application Date: 2017-12-22
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Publication No.: US10243561B2Publication Date: 2019-03-26
- Inventor: Archanna Srinivasan , Guang Chen , Jun Pin Tan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Treyz Law Group, P.C.
- Agent Jason Tsai
- Main IPC: H03K19/003
- IPC: H03K19/003 ; H03K19/00 ; H03K19/177 ; G11C7/00

Abstract:
An integrated circuit configured to execute multiple operations in parallel is provided. The integrated circuit may be organized into multiple logic sectors. Two or more groups of logic sectors may be executed in an interleaved fashion, where successive groups of logic sectors are activated after a predetermined amount of delay. The integrated circuit may include an array of memory cells. Rows of the memory cells may be accessed in an interleaving manner, where successive rows of memory cells are selected after a predetermined amount of delay. Operating groups of circuit components using an interleaving scheme can help improve operational efficiency while reducing power supply noise without having to increase die area for on-die decoupling capacitance.
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