Invention Grant
- Patent Title: Substrate with insulating layer
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Application No.: US15031594Application Date: 2014-02-14
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Publication No.: US10244647B2Publication Date: 2019-03-26
- Inventor: Kuan-Ting Wu , Yu-Chuan Kang , Chung-Hung Huang
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2014/016400 WO 20140214
- International Announcement: WO2015/122901 WO 20150820
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/04 ; H05H1/48 ; C25D13/10 ; C25D13/12 ; C25D11/02 ; C25D11/06 ; C25D11/26 ; C25D11/30 ; C25D11/34 ; C25D13/22 ; C25D15/00 ; C09D5/44 ; C25D13/14
Abstract:
A substrate with a Micro-Arc Oxidation (MAO) layer or an electrophoretic deposition (ED) layer on a first side of the substrate and an electrically insulating layer on a second side of the substrate.
Public/Granted literature
- US20160345451A1 SUBSTRATE WITH INSULATING LAYER Public/Granted day:2016-11-24
Information query
