Invention Grant
- Patent Title: Configurable interconnect apparatus and method
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Application No.: US15660819Application Date: 2017-07-26
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Publication No.: US10261923B2Publication Date: 2019-04-16
- Inventor: Kaushik Vaidyanathan , Daniel H. Morris , Uygar E. Avci , Ian A. Young , Tanay Karnik , Huichu Liu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard, & Mughal LLP
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F1/26 ; G06F13/10 ; G06F9/445

Abstract:
Described is an apparatus which comprises: a first electrical path comprising at least one driver and receiver; and a second electrical path comprising at least one driver and receiver, wherein the first and second electrical paths are to receive a same input signal, wherein the first electrical path and the second electrical path are parallel to one another and have substantially the same propagation delays, and wherein the second electrical path is enabled during a first operation mode and disabled during a second operation mode.
Public/Granted literature
- US20190034360A1 CONFIGURABLE INTERCONNECT APPARATUS AND METHOD Public/Granted day:2019-01-31
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