- Patent Title: Nitride semiconductor element and method for manufacturing the same
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Application No.: US15714791Application Date: 2017-09-25
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Publication No.: US10263152B2Publication Date: 2019-04-16
- Inventor: Tomohiro Shimooka , Masahiko Sano , Naoki Azuma
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2014-111966 20140530; JP2015-107307 20150527
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L33/32 ; H01L33/00 ; H01L33/02 ; H01L33/20 ; H01L33/12 ; H01L33/16

Abstract:
A nitride semiconductor element includes a sapphire substrate including: a main surface extending in a c-plane of the sapphire substrate, and a plurality of projections disposed at the main surface, the plurality of projections including at least one projection having an elongated shape in a plan view; and a nitride semiconductor layer disposed on the main surface of the sapphire substrate. The at least one projection has an outer edge extending in a longitudinal direction of the elongated shape, the outer edge extending in a direction oriented at an angle in a range of −10° to +10° with respect to an a-plane of the sapphire substrate in the plan view.
Public/Granted literature
- US20180047874A1 NITRIDE SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-02-15
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