Invention Grant
- Patent Title: Flexible electronic assemblies with embedded electronic devices and methods for their fabrication
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Application No.: US15141149Application Date: 2016-04-28
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Publication No.: US10264669B2Publication Date: 2019-04-16
- Inventor: Jay Lewis , Dorota Temple , Erik Vick , Ethan Klem
- Applicant: Research Triangle Institute
- Applicant Address: US NC Research Triangle Park
- Assignee: Research Triangle Institute
- Current Assignee: Research Triangle Institute
- Current Assignee Address: US NC Research Triangle Park
- Agency: Olive Law Group, PLLC
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/18 ; H05K3/30 ; H05K3/40 ; H05K3/46 ; H05K1/11
Abstract:
A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.
Public/Granted literature
- US20170064810A1 FLEXIBLE ELECTRONIC ASSEMBLIES WITH EMBEDDED ELECTRONIC DEVICES AND METHODS FOR THEIR FABRICATION Public/Granted day:2017-03-02
Information query
