公开(公告)号：US10264669B2

公开(公告)日：2019-04-16

申请号：US15141149

申请日：2016-04-28

Applicant: Research Triangle Institute

Inventor： Jay Lewis ,  Dorota Temple ,  Erik Vick ,  Ethan Klem

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.

公开(公告)号：US20170064810A1

公开(公告)日：2017-03-02

申请号：US15141149

申请日：2016-04-28

Applicant: Research Triangle Institute

Inventor： Jay Lewis ,  Dorota Temple ,  Erik Vick ,  Ethan Klem

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/028 ,  H05K1/0206 ,  H05K1/0224 ,  H05K1/115 ,  H05K1/185 ,  H05K1/186 ,  H05K1/189 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/301 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2203/025

Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.

Abstract translation: 柔性电子组件包括柔性载流装置，电绝缘柔性基板和嵌入基板中的电子装置。 电子装置面向下安装在载流装置上，使得电子装置的接触侧或部件侧面向载流装置并且位于载流装置和基板之间的界面处。 载流装置，基板和电子装置在界面处是共面的。 该配置使得柔性电子组件具有超薄的厚度，例如几微米的数量级。