Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US15928516Application Date: 2018-03-22
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Publication No.: US10269958B2Publication Date: 2019-04-23
- Inventor: Jae Hong Kwon , Youngho Lee , Hoon Lim , Hyungsoon Jang , Eunguk Chung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2015-0190834 20151231
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/092 ; H01L27/11 ; H01L29/08 ; H01L29/16 ; H01L29/66 ; H01L21/8238 ; H01L49/02 ; H01L29/10 ; H01L29/165

Abstract:
A semiconductor device includes first source/drain regions disposed at both sides of a first gate structure and including dopants of a first conductivity type, counter regions being in contact with upper portions of the first source/drain regions and under both end portions of the first gate structure, and first halo regions in contact with bottom surfaces of the first source/drain regions. The counter regions include dopants of a second conductivity type that is different from the first conductivity type. The first halo regions include dopants of the second conductivity type.
Public/Granted literature
- US20180219094A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2018-08-02
Information query
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