Invention Grant
- Patent Title: Metal density distribution for double pattern lithography
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Application No.: US13686184Application Date: 2012-11-27
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Publication No.: US10283437B2Publication Date: 2019-05-07
- Inventor: Richard T. Schultz , Omid Rowhani , Charles P. Tung
- Applicant: ADVANCED MICRO DEVICES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L23/48 ; H01L21/311 ; G03F7/00
Abstract:
Methods, a computer readable medium, and an apparatus are provided. A method includes and the computer readable medium is configured for decomposing an overall pattern into a first mask pattern that includes a power rail base pattern and into a second mask pattern, and generating on the second mask pattern a power rail insert pattern that is at least partially aligned with the power rail base pattern of the first mask pattern. The apparatus is produced by photolithography using photolithographic masks generated by the method.
Public/Granted literature
- US20140145342A1 METAL DENSITY DISTRIBUTION FOR DOUBLE PATTERN LITHOGRAPHY Public/Granted day:2014-05-29
Information query
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