Invention Grant
- Patent Title: Semiconductor device and method of manufacturing a semiconductor device
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Application No.: US15810289Application Date: 2017-11-13
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Publication No.: US10283451B2Publication Date: 2019-05-07
- Inventor: Kyoung-hoon Kim , Woo-sung Yang , Jee-hoon Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2015-0119814 20150825
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L21/033 ; H01L21/311 ; H01L21/321 ; H01L27/11582 ; H01L21/3213 ; H01L49/02 ; H01L27/11517 ; H01L27/11563

Abstract:
A semiconductor device includes a plurality of line patterns formed apart from one another on a substrate, the plurality of line patterns having a first width and extending parallel to one another in a first direction. A first line pattern of the plurality of line patterns may include a wider portion having a second width in a second direction perpendicular to the first direction that is greater than the first width. One or more second line patterns may be located adjacent to the first line pattern and include a conformal portion conformally formed about the wider portion of the first line pattern. One or more third line patterns may be located adjacent to the second line pattern and include an end portion near the conformal portion of the one or more second line pattern.
Public/Granted literature
- US20180068944A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2018-03-08
Information query
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