- 专利标题： CMP slurry composition for organic film and polishing method using same
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申请号： US15326199申请日： 2015-06-10
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公开(公告)号： US10287468B2公开(公告)日： 2019-05-14
- 发明人: Yong Sik Yoo , Jung Min Choi , Dong Hun Kang , Tae Wan Kim , Go Un Kim , Yong Kuk Kim
- 申请人： SAMSUNG SDI CO., LTD.
- 申请人地址： KR Yongin-si, Gyeonggi-do
- 专利权人： SAMSUNG SDI CO., LTD.
- 当前专利权人： SAMSUNG SDI CO., LTD.
- 当前专利权人地址： KR Yongin-si, Gyeonggi-do
- 代理机构： Lee & Morse, P.C.
- 优先权： KR10-2014-0161958 20141119
- 国际申请： PCT/KR2015/005856 WO 20150610
- 国际公布： WO2016/080614 WO 20160526
- 主分类号： C09K3/14
- IPC分类号： C09K3/14 ; H01L21/304 ; H01L21/3105
摘要：
The present invention relates to a CMP slurry composition, for an organic film, for polishing an organic film and an organic film polishing method using same, the CMP slurry composition comprising: a polar solvent and/or a non-polar solvent; metal oxide abrasives; an oxidant; and a heterocyclic compound, wherein the heterocyclic compound, as a heteroatom, comprises one or two of oxygen (O) atom, sulfur (S) atom and nitrogen (N) atom and has carbon content of 50-95 atom %.
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