公开(公告)号：US10287468B2

公开(公告)日：2019-05-14

申请号：US15326199

申请日：2015-06-10

申请人： SAMSUNG SDI CO., LTD.

发明人： Yong Sik Yoo ,  Jung Min Choi ,  Dong Hun Kang ,  Tae Wan Kim ,  Go Un Kim ,  Yong Kuk Kim

IPC分类号： C09K3/14 ,  H01L21/304 ,  H01L21/3105

摘要： The present invention relates to a CMP slurry composition, for an organic film, for polishing an organic film and an organic film polishing method using same, the CMP slurry composition comprising: a polar solvent and/or a non-polar solvent; metal oxide abrasives; an oxidant; and a heterocyclic compound, wherein the heterocyclic compound, as a heteroatom, comprises one or two of oxygen (O) atom, sulfur (S) atom and nitrogen (N) atom and has carbon content of 50-95 atom %.

公开(公告)号：US10723916B2

公开(公告)日：2020-07-28

申请号：US16100561

申请日：2018-08-10

申请人： Samsung SDI Co., Ltd.

发明人： Jung Min Choi ,  Haruki Nojo ,  Yong Soon Park ,  Yong Sik Yoo ,  Dong Hun Kang ,  Go Un Kim ,  Tae Wan Kim

IPC分类号： C09G1/02 ,  C09G1/06 ,  C09G1/00 ,  C09K3/14 ,  C09K13/06 ,  C09G1/04 ,  B24B37/04 ,  H01L21/321 ,  H01L21/3105 ,  B24B1/00 ,  H01L21/306

摘要： The present invention relates to an organic film CMP slurry composition for polishing an organic film, which includes at least either of a polar solvent or a non-polar solvent and a metal oxide abrasive, is acidic, and has a carbon content of around 50 to 95 atm %, and a polishing method using the same.