Invention Grant
- Patent Title: Pressure-sensitive adhesive film
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Application No.: US15051771Application Date: 2016-02-24
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Publication No.: US10293435B2Publication Date: 2019-05-21
- Inventor: Kenta Yamashita , Mitsushi Yamamoto , Donald Pinxten , Bert Cryns
- Applicant: NITTO DENKO CORPORATION , NITTO EUROPE N.V.
- Applicant Address: JP Ibaraki-shi, Osaka BE Eikelaarstraat, Genk
- Assignee: NITTO DENKO CORPORATION,NITTO EUROPE N.V.
- Current Assignee: NITTO DENKO CORPORATION,NITTO EUROPE N.V.
- Current Assignee Address: JP Ibaraki-shi, Osaka BE Eikelaarstraat, Genk
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-141996 20120625
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B27/36 ; C09J7/29 ; B23K26/38 ; B23K26/18 ; B23K26/00 ; B23K26/36 ; B32B27/20 ; B32B27/32 ; C08K3/04 ; C09J107/00 ; C08K3/013

Abstract:
The pressure-sensitive adhesive film according to the present invention comprises a resin film as a substrate and a pressure-sensitive adhesive layer provided at least on a face of the resin film. The resin film has a multi-layer constitution consisting of at least two layers. The resin film has a laser beam reflectance of 5% or higher, but 40% or lower in a wavelength range of 1000 nm to 1100 nm, and has a laser beam transmittance of 5% or lower in the said wavelength range.
Public/Granted literature
- US20160168426A1 PRESSURE-SENSITIVE ADHESIVE FILM Public/Granted day:2016-06-16
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