- 专利标题： Method for producing an electronic component and electronic component
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申请号： US14540670申请日： 2014-11-13
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公开(公告)号： US10297469B2公开(公告)日： 2019-05-21
- 发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
- 申请人： Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
- 申请人地址： DE Regensburg
- 专利权人： OSRAM OLED GmbH
- 当前专利权人： OSRAM OLED GmbH
- 当前专利权人地址： DE Regensburg
- 代理机构： Cozen O'Connor
- 优先权： DE102008006721 20080130; DE102008019900 20080421; DE102008031405 20080702; DE102008048472 20080923
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/02 ; H01L31/18 ; H01L51/00 ; H01L51/56 ; H01L23/29 ; H01L23/00 ; H01L23/31 ; C23C16/02 ; C23C16/455 ; C23C16/50 ; C23C16/54 ; H01L31/0216 ; H01L51/52 ; H01L33/62 ; H01L33/48 ; H01L33/54
摘要：
A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).