公开(公告)号：US10124433B2

公开(公告)日：2018-11-13

申请号：US13263605

申请日：2010-03-31

申请人： Christian Schmid ,  Simon Olschok ,  Claas Bruns

发明人： Christian Schmid ,  Simon Olschok ,  Claas Bruns

IPC分类号： B23K26/00 ,  B23K9/028 ,  B23K28/02 ,  B23K26/14 ,  B23K26/282 ,  B23K101/06 ,  B23K103/04

摘要： The invention relates to a method for connecting the ends of steel tubes by means of orbital welding using a hybrid laser arc technique, with the tubes preferably having wall thicknesses ≥6 mm and more particularly ≥12 mm and diameters of preferably ≥150 mm, the ends of which tubes are connected by one or more welding passes, wherein the laser and arc welding heads as tools are guided over a guide ring fixedly arranged around a tube end in the region of the weld site during the welding and are displaced around the tube diameter. The invention also relates to a device for carrying out the method, wherein the laser and the arc welding heads are positioned separately on the guide ring and are moved over the tube circumference and controlled independently of one another during the welding process.

公开(公告)号：US20150072451A1

公开(公告)日：2015-03-12

申请号：US14540670

申请日：2014-11-13

申请人： Christian Schmid ,  Tilman Schlenker ,  Heribert Zull ,  Ralph Paetzold ,  Markus Klein ,  Karsten Heuser

发明人： Christian Schmid ,  Tilman Schlenker ,  Heribert Zull ,  Ralph Paetzold ,  Markus Klein ,  Karsten Heuser

IPC分类号： H01L21/56 ,  H01L51/00 ,  H01L51/56 ,  H01L21/02 ,  H01L31/18

CPC分类号： H01L21/56 ,  C23C16/0272 ,  C23C16/45525 ,  C23C16/50 ,  C23C16/54 ,  H01L21/02274 ,  H01L21/02282 ,  H01L23/293 ,  H01L23/31 ,  H01L23/3135 ,  H01L23/564 ,  H01L31/0216 ,  H01L31/18 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L51/0001 ,  H01L51/5237 ,  H01L51/5256 ,  H01L51/56 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

摘要： A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).

摘要翻译： 一种电子部件和电子部件的制造方法，具有用于封装部件的阻挡层。 该方法包括向基板（1）提供至少一个功能层（22）和电子部件，通过无质原子层沉积（PLALD）在功能层（22）上施加至少一个第一阻挡层（3） ），以及通过等离子体增强化学蒸气沉积（PECVD）在功能层（22）上施加至少一个第二阻挡层（4）。

公开(公告)号：US08916397B2

公开(公告)日：2014-12-23

申请号：US12865346

申请日：2009-01-29

申请人： Christian Schmid ,  Tilman Schlenker ,  Heribert Zull ,  Ralph Paetzold ,  Markus Klein ,  Karsten Heuser

发明人： Christian Schmid ,  Tilman Schlenker ,  Heribert Zull ,  Ralph Paetzold ,  Markus Klein ,  Karsten Heuser

IPC分类号： H01L33/52 ,  H01L31/18 ,  H01L31/0216 ,  H01L23/31 ,  H01L51/56 ,  H01L21/56 ,  C23C16/54 ,  C23C16/02 ,  H01L51/52 ,  C23C16/455 ,  C23C16/50

CPC分类号： H01L21/56 ,  C23C16/0272 ,  C23C16/45525 ,  C23C16/50 ,  C23C16/54 ,  H01L21/02274 ,  H01L21/02282 ,  H01L23/293 ,  H01L23/31 ,  H01L23/3135 ,  H01L23/564 ,  H01L31/0216 ,  H01L31/18 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L51/0001 ,  H01L51/5237 ,  H01L51/5256 ,  H01L51/56 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

摘要： A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).

摘要翻译： 一种用于制造包括用于封装组件的阻挡层的电子部件的方法，特别地包括以下步骤：向衬底（1）提供至少一个功能层（22），施加至少一个第一阻挡层（3） ）通过无等离子体原子层沉积（PLALD）在功能层（22）上，以及通过等离子体增强化学气相沉积（PECVD）在功能层（22）上施加至少一个第二阻挡层（4）。

公开(公告)号：US08685864B2

公开(公告)日：2014-04-01

申请号：US13502648

申请日：2010-07-28

申请人： Christian Schmid

发明人： Christian Schmid

IPC分类号： H01L21/302

CPC分类号： H01L21/67706 ,  H01L21/67051 ,  H01L21/67086 ,  H01L21/6776

摘要： In a method for the treatment of a substrate surface of a flat substrate with a process medium at the substrate underside, the process medium has a removing or etching effect on the substrate surface. The substrates are wetted with the process medium from below in a manner lying horizontally. The upwardly facing substrate top side is wetted or covered with water or a corresponding protective liquid over a large area or over the whole area as protection against the process medium acting on the substrate top side.

摘要翻译： 在基板底面用处理介质处理平坦基板的基板表面的方法中，处理介质对基板表面具有去除或蚀刻效果。 用水平方式从下方用处理介质润湿基板。 面向上的基板顶侧在大面积或整个区域上被润湿或覆盖有水或相应的保护液体，作为对作用在基板顶侧上的处理介质的保护。

公开(公告)号：US08673255B2

公开(公告)日：2014-03-18

申请号：US13131158

申请日：2009-11-27

申请人： Adolf Petrik ,  Christian Schmid ,  Jochem Hahn

发明人： Adolf Petrik ,  Christian Schmid ,  Jochem Hahn

IPC分类号： C01B33/02

CPC分类号： C01B33/027 ,  B01J19/2405 ,  C01B33/029 ,  C01B33/03

摘要： A process for preparing high-purity silicon by thermal decomposition of a silicon compound includes decomposing the silicon compound by mixing with a carrier gas at a temperature at which the silicon compound is thermally decomposed.

摘要翻译： 通过硅化合物的热分解制备高纯度硅的方法包括通过在硅化合物被热分解的温度下与载气混合来分解硅化合物。

公开(公告)号：US08658442B2

公开(公告)日：2014-02-25

申请号：US12865358

申请日：2009-01-29

申请人： Christian Schmid ,  Tilman Schlenker ,  Heribert Zull ,  Ralph Paetzold ,  Markus Klein ,  Karsten Heuser

发明人： Christian Schmid ,  Tilman Schlenker ,  Heribert Zull ,  Ralph Paetzold ,  Markus Klein ,  Karsten Heuser

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  C23C16/0272 ,  C23C16/45525 ,  C23C16/50 ,  C23C16/54 ,  H01L21/02274 ,  H01L21/02282 ,  H01L23/293 ,  H01L23/31 ,  H01L23/3135 ,  H01L23/564 ,  H01L31/0216 ,  H01L31/18 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L51/0001 ,  H01L51/5237 ,  H01L51/5256 ,  H01L51/56 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

摘要： A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasma-enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).

摘要翻译： 一种用于制造包括用于封装组件的阻挡层的电子部件的方法，特别地包括以下步骤：向衬底（1）提供至少一个功能层（22），施加至少一个第一阻挡层（3） ）通过等离子体增强原子层沉积（PEALD）在功能层（22）上，并且通过等离子体增强化学气相沉积（PECVD）在功能层（22）上施加至少一个第二阻挡层（4） ）。

公开(公告)号：US20120189526A1

公开(公告)日：2012-07-26

申请号：US13388692

申请日：2010-08-02

申请人： Adolf Petrik ,  Jochem Hahn ,  Christian Schmid

发明人： Adolf Petrik ,  Jochem Hahn ,  Christian Schmid

IPC分类号： C01B33/107 ,  B01J8/26

CPC分类号： C01B33/1071 ,  C01B33/10763

摘要： A process for preparing trichlorosilane includes reacting silicon particles with tetrachlorosilane and hydrogen and optionally with hydrogen chloride in a fluidized-bed reactor to form a trichlorosilane-containing product gas stream, where the trichlorosilane-containing product gas stream is discharged from the reactor via an outlet preceded by at least one particle separator which selectively allows only silicon particles up to a particular maximum size to pass through and silicon particles are discharged from the reactor at preferably regular intervals or continuously via at least one further outlet without such a particle separator.

摘要翻译： 制备三氯硅烷的方法包括在流化床反应器中使硅颗粒与四氯硅烷和氢气以及任选地与氯化氢反应形成含三氯硅烷的产物气流，其中含三氯硅烷的产物气流通过出口从反应器排出 之前有至少一个颗粒分离器，其选择性地仅允许直到特定最大尺寸的硅颗粒通过，并且硅颗粒以优选规则的间隔或连续经由至少另外一个出口排出反应器，而没有这种颗粒分离器。

公开(公告)号：US20110266590A1

公开(公告)日：2011-11-03

申请号：US13054397

申请日：2009-06-19

申请人： Karsten Heuser ,  Christian Schmid ,  Tilman Schlenker ,  Peter Groeppel

发明人： Karsten Heuser ,  Christian Schmid ,  Tilman Schlenker ,  Peter Groeppel

IPC分类号： H01L33/52 ,  H01L33/36

CPC分类号： H01L51/5253 ,  H01L51/5246

摘要： A method for encapsulating an optoelectronic component by depositing a diffusion barrier for protection against environmental influences by means of an atmospheric pressure plasma on at least one subarea of the surface of the optoelectronic component.

摘要翻译： 一种通过沉积扩散屏障来封装光电子部件的方法，用于通过在光电子部件的表面的至少一个子区域上的大气压等离子体来防止对环境的影响。

公开(公告)号：US20110262338A1

公开(公告)日：2011-10-27

申请号：US12935093

申请日：2009-03-31

申请人： Christian Schmid ,  Adolf Petrik ,  Jochem Hahn

发明人： Christian Schmid ,  Adolf Petrik ,  Jochem Hahn

IPC分类号： C01B33/021 ,  B01J19/00

CPC分类号： C01B33/035 ,  C01B33/029 ,  C01B33/043 ,  C01B33/10763 ,  C01B33/10773 ,  Y02P20/127

摘要： A process for producing high-purity silicon includes (1) preparing trichlorosilane by reacting silicon with hydrogen chloride in at least one hydrochlorination process; (2) preparing monosilane by disproportionation of the trichlorosilane to provide a monosilane-containing reaction mixture containing silicon tetrachloride as a by-product; (3) in parallel to (1), reacting silicon tetrachloride obtained as the by-product in (2) with silicon and hydrogen in at least one converting process to produce a trichlorosilane-containing reaction mixture; and (4) thermally decomposing the monosilane into silicon and hydrogen.

摘要翻译： 一种生产高纯度硅的方法包括（1）在至少一个氢氯化法中使硅与氯化氢反应制备三氯硅烷; （2）通过歧化三氯硅烷制备甲硅烷，以提供含有四氯化硅作为副产物的含甲硅烷的反应混合物; （3）平行于（1），在（2）中作为副产物获得的四氯化硅与硅和氢在至少一个转化方法中反应，生成含三氯硅烷的反应混合物; 和（4）将硅烷分解为硅和氢。

公开(公告)号：US08007096B2

公开(公告)日：2011-08-30

申请号：US10696344

申请日：2003-10-29

申请人： Christian Schmid ,  John L. Stoffel ,  Bill Sperry

发明人： Christian Schmid ,  John L. Stoffel ,  Bill Sperry

IPC分类号： G01D11/00

CPC分类号： C09D11/50 ,  C09D11/32

摘要： Highlighter ink compositions can be prepared which provide improved abilities to reduce smear during highlighting. Highlighter ink compositions can include an acid buffer having a pKa from about 2 to about 6, a highlighter colorant, and a liquid vehicle. The image for highlighting can be formed on the substrate using any conventional printing technique, such as ink-jet printing or other printing techniques. Application of the highlighter ink compositions of the present invention to a printed image results in a reduced degree of image smear, particularly when the image was produced by an ink-jet printing process. Further, the acid buffer can be configured for reducing mobility of specific ink-jet colorants. In this way, the highlighter ink composition can be specifically tailored for reducing smear of various printed inks.

摘要翻译： 可以制备荧光笔油墨组合物，其提供在突出显示期间减少涂片的改进的能力。 荧光笔油墨组合物可以包括具有约2至约6的pKa的酸缓冲液，荧光增白剂和液体载体。 用于突出显示的图像可以使用任何常规的打印技术（诸如喷墨打印或其它打印技术）在基板上形成。 本发明的荧光笔油墨组合物对印刷图像的应用导致图像涂抹程度降低，特别是当通过喷墨印刷方法制造图像时。 此外，酸缓冲液可以被配置为降低特定喷墨着色剂的流动性。 以这种方式，荧光笔墨水组合物可以专门用于减少各种印刷油墨的污迹。