Methods and systems for monitoring an integrity of electrical connectivity between a repair patch and a parent structure include providing the repair patch with an embedded sensor configured to detect electrical conductivity. The repair patch includes a ply of conductive material that overlaps a portion of a conductive layer of the parent structure. A baseline set of sensor data is acquired from the sensor indicative of an electrical connectivity between the ply of conductive material of the repair patch and the conductive layer of the parent structure. One or more additional sets of data may be obtained from the sensor and compared to the baseline set of data to determine an integrity of the electrical connectivity between the ply of conductive material of the repair patch and the conductive layer of the parent structure.