- 专利标题： Robust inertial sensors
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申请号： US15108414申请日： 2014-12-30
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公开(公告)号： US10317211B2公开(公告)日： 2019-06-11
- 发明人: Bongsang Kim , Ando Feyh , Andrew Graham , Gary O'Brien , Michael Baus , Ralf Maier , Mariusz Koc
- 申请人： Robert Bosch GmbH , Bongsang Kim , Ando Feyh , Andrew Graham , Gary O'Brien , Michael Baus , Ralf Maier , Mariusz Koc
- 申请人地址： DE Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DE Stuttgart
- 代理机构： Maginot Moore & Beck LLP
- 国际申请： PCT/US2014/072694 WO 20141230
- 国际公布： WO2015/103220 WO 20150709
- 主分类号： G01P1/02
- IPC分类号： G01P1/02 ; G01C19/5769 ; G01P15/08 ; G01D5/241 ; G01P1/00 ; G01P15/18
摘要：
In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.
公开/授权文献
- US20160327392A1 Robust Inertial Sensors 公开/授权日：2016-11-10
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