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    Composite mechanical transducers and approaches therefor
    3.
    发明申请
    Composite mechanical transducers and approaches therefor 有权
    复合机械传感器及其方法

    公开(公告)号：US20070277620A1

    公开(公告)日：2007-12-06

    申请号：US11446568

    申请日：2006-06-02

    申请人： Renata Melamud ,  Bongsang Kim ,  Matt Hopcroft ,  Saurabh Chandorkar ,  Manu Agarwal ,  Thomas W. Kenny

    发明人： Renata Melamud ,  Bongsang Kim ,  Matt Hopcroft ,  Saurabh Chandorkar ,  Manu Agarwal ,  Thomas W. Kenny

    IPC分类号： G01L1/00

    CPC分类号： G01L9/0022 ,  G01L19/04 ,  H03H9/2473

    摘要： Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.

    摘要翻译： 诸如压力传感器，谐振器或其他频率参考装置之类的机械传感器在不同温度的特征的条件下实现。 根据本发明的示例性实施例，为机械传感器应用实现材料的组合以减轻温度相关的变化。 在一个应用中，材料性质失配用于促进单锚传感器应用，例如用于谐振器。 另一种应用是针对硅 - 二氧化硅的材料组合。

    Composite mechanical transducers and approaches therefor
    5.
    发明授权
    Composite mechanical transducers and approaches therefor 有权
    复合机械传感器及其方法

    公开(公告)号：US07806586B2

    公开(公告)日：2010-10-05

    申请号：US11446568

    申请日：2006-06-02

    申请人： Renata Melamud ,  Bongsang Kim ,  Matt Hopcroft ,  Saurabh Chandorkar ,  Manu Agarwal ,  Thomas W. Kenny

    发明人： Renata Melamud ,  Bongsang Kim ,  Matt Hopcroft ,  Saurabh Chandorkar ,  Manu Agarwal ,  Thomas W. Kenny

    IPC分类号： G01K11/22

    CPC分类号： G01L9/0022 ,  G01L19/04 ,  H03H9/2473

    摘要： Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.

    摘要翻译： 诸如压力传感器，谐振器或其他频率参考装置之类的机械传感器在不同温度的特征的条件下实现。 根据本发明的示例性实施例，为机械传感器应用实现材料的组合以减轻温度相关的变化。 在一个应用中，材料性质失配用于促进单锚传感器应用，例如用于谐振器。 另一种应用是针对硅 - 二氧化硅的材料组合。

    MICROELECTROMECHANICAL SYSTEM (MEMS) RESONANT SWITCHES AND APPLICATIONS FOR POWER CONVERTERS AND AMPLIFIERS
    8.
    发明申请
    MICROELECTROMECHANICAL SYSTEM (MEMS) RESONANT SWITCHES AND APPLICATIONS FOR POWER CONVERTERS AND AMPLIFIERS 有权
    微电子机电系统（MEMS）谐振开关和功率转换器和放大器的应用

    公开(公告)号：US20110067984A1

    公开(公告)日：2011-03-24

    申请号：US12878237

    申请日：2010-09-09

    申请人： Clark Tu-Cuong Nguyen ,  Yang Lin ,  Wei-Chang Li ,  Bongsang Kim

    发明人： Clark Tu-Cuong Nguyen ,  Yang Lin ,  Wei-Chang Li ,  Bongsang Kim

    IPC分类号： H01H57/00

    CPC分类号： H01P1/127 ,  H01H1/0036 ,  H01H50/005

    摘要： A modally driven oscillating element periodically contacts one of more electrical contacts, thereby acting as a switch, otherwise known as a resonant switch, or “resoswitch”, with very high Q's, typically above 10000 in air, and higher in vacuum. Due to periodic constrained contacting of the contacts, the bandwidth of the switch is greatly improved. One or more oscillating elements may be vibrationally interconnected with conductive or nonconductive coupling elements, whereby increased bandwidths of such an overall switching system may be achieved. Using the resoswitch, power amplifiers and converters more closely approaching ideal may be implemented. Integrated circuit fabrication techniques may construct the resoswitch with other integrated CMOS elements for highly compact switching devices. Through introduction of specific geometries within the oscillating elements, displacement gains may be made where modal deflections are greatly increased, thereby reducing device drive voltages to 2.5 V or lower.

    摘要翻译： 模态驱动的振荡元件周期性地接触一个更多的电触点，从而充当开关，或称为谐振开关或“再开关”，具有非常高的Q值，通常在空气中高于10000，而在真空中更高。 由于触点的周期性约束接触，开关的带宽大大提高。 一个或多个振荡元件可以与导电或非导电耦合元件振动地互连，由此可以实现这种整体开关系统的增加的带宽。 可以实现使用resoswitch，功率放大器和更接近理想的转换器。 集成电路制造技术可以使用其他集成CMOS元件构建重新开关，用于高度紧凑的开关器件。 通过在振荡元件中引入特定的几何形状，可以在模态偏转大大增加的情况下进行位移增益，从而将器件驱动电压降低到2.5V或更低。