摘要:
The invention relates to a process for separating off solid particles, in particular coke particles, from a water phase by means of gravity in a plant for generating hydrocarbons by cracking a hydrocarbonaceous feed, and also to a device for carrying out the process. In contrast to the prior art, the water phase is taken off predominantly from a point above the column bottom B via the outlet A. The first gravity separator 2 which is constructed as a multistage settling tank 2 is situated not beneath, but next to, the scrubbing water column 1. The bottom phase of the scrubbing water column 1 already acts as a part of the first gravity separator 2. Thus, via the outlet 5 in the column bottom B, a heavy water phase which is loaded with coke particles is already taken off and passed into the second gravity separator 3. This heavy water phase is further treated, together with the heavy water phase which is loaded with coke particles from the recesses 6 of the multistage settling tank 2. In this embodiment of the invention, the feed rate into the multistage settling tank 2 need not be controlled as in the prior art. The multistage settling tank 2 and the bottom phase of the quench column 1 form a communicating liquid system in which the same level of the water phase is established.
摘要:
A micromechanical sensor element includes: a substrate; a first seismic mass suspended from the substrate, which is deflectable from a first rest position by an acceleration acting perpendicularly to a main plane of extension; and a second seismic mass, which is deflectable from a second rest position by the acceleration. At least a partial overlap is provided between the first seismic mass and the second seismic mass perpendicular to the main plane of extension.
摘要:
A method for carrying out a self-test for a micromechanical sensor device, and a corresponding micromechanical sensor device. The method has the following steps: exciting the sensor device using a first excitation signal variation in a first self-test; storing a corresponding first response signal variation of the sensor device; exciting the sensor device using a second excitation signal variation in a second self-test; storing a corresponding second response signal variation of the sensor device; analyzing the first and second response signal variations with regard to at least one predefined criterion; and preparing a self-test result based on the analytical result of the first and second response signal variations.
摘要:
A method for monitoring a frequency signal provided within a unit is disclosed. The method comprises a step of receiving one or more binary signal levels of a cycle signal (CLK) or a control signal (CS) from a communication interface (CLK, CS, MOSI, MISO), wherein the communication interface (CLK, CS, MOSI, MISO) is designed to transfer information according to a communication protocol. The method further comprises a step of providing the frequency signal in the unit and comparing the frequency signal to a temporal sequence of signal levels of the cycle signal (CLK) received by the communication interface (CLK, CS, MOSI, MISO) in order to obtain a comparison result or controlling a counter by the control signal (CS) and the frequency signal in order to obtain a counter status. Finally, the method according to the disclosure comprises a step of recognizing a predetermined quality of the frequency signal if the comparison result fulfills a predetermined criterion or if the counter status lies within a predetermined value range in order to monitor by the recognized quality of the frequency signal.
摘要:
An offset compensation circuit for a yaw rate sensor, having a subtracter, which is provided for subtracting a correction value from an input signal, the correction value being obtainable by dividing each of n measurements of the input signal by the constant n and subsequently integrating a number of n quotients into an integrator. Furthermore, a yaw rate sensor having such an offset compensation circuit.
摘要:
In one embodiment, a sensor includes a rigid wafer outer body, a first cavity located within the rigid wafer outer body, a first spring supported by the rigid wafer outer body and extending into the first cavity, a second spring supported by the rigid wafer outer body and extending into the first cavity, and a first sensor structure supported by the first spring and the second spring within the first cavity.
摘要:
The invention relates to a distribution system (1) for distributing a fluid (15) into a container (27) from a fluid inlet (26) of the container (27). Distribution system (1) comprises one or more guide plates that form a guide section (2) and a distribution section (3) that adjoins the guide section (2). Distribution section (3) has regions (4, 5) with openings (8, 9) for allowing fluid (17) to pass through. The invention also relates to a heat exchanger device (100) that has a container (27) with a fluid inlet (26), with at least one heat exchanger block (28) that is arranged in the container (27). A distribution system (101) according to the invention is arranged in the container (27) above the heat exchanger block (28).
摘要:
A method for securing data packets to be transmitted via an interface includes determining a check number over at least a portion of a first data packet and at least one portion of a second data packet. For this purpose, the first data packet is arranged according to a transfer protocol in a first data frame and the second data packet is arranged according to the transfer protocol in a second data frame.
摘要:
An offset compensation circuit for a yaw rate sensor, having a subtracter, which is provided for subtracting a correction value from an input signal, the correction value being obtainable by dividing each of n measurements of the input signal by the constant n and subsequently integrating a number of n quotients into an integrator. Furthermore, a yaw rate sensor having such an offset compensation circuit.
摘要:
In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.