公开(公告)号：US20160327392A1

公开(公告)日：2016-11-10

申请号：US15108414

申请日：2014-12-30

Applicant: Bonsang Kim ,  Ando Feyh ,  Andrew Graham ,  Gary O'Brien ,  Michael Baus ,  Ralf Maier ,  Mariusz Koc ,  Robert Bosch GmbH

Inventor： Bonsang Kim ,  Ando Feyh ,  Andrew Graham ,  Gary O'Brien ,  Michael Baus ,  Ralf Maier ,  Mariusz Koc

IPC: G01C19/5769

CPC classification number: G01C19/5769 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/012 ,  G01P1/003 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0882 ,  H01L2224/48137 ,  H01L2924/16152

Abstract: In one embodiment, a sensor includes a rigid wafer outer body, a first cavity located within the rigid wafer outer body, a first spring supported by the rigid wafer outer body and extending into the first cavity, a second spring supported by the rigid wafer outer body and extending into the first cavity, and a first sensor structure supported by the first spring and the second spring within the first cavity.

Abstract translation: 在一个实施例中，传感器包括刚性晶片外部主体，位于刚性晶片外部主体内的第一腔体，由刚性晶片外部主体支撑并延伸到第一腔体中的第一弹簧，由刚性晶片外部支撑的第二弹簧 并且延伸到第一腔体中，以及由第一弹簧和第二弹簧支撑在第一腔内的第一传感器结构。

公开(公告)号：US09189894B2

公开(公告)日：2015-11-17

申请号：US14000063

申请日：2011-12-22

Applicant: Matthias Marcus Wellhoefer ,  Mariusz Koc

Inventor： Matthias Marcus Wellhoefer ,  Mariusz Koc

IPC: G06F7/00 ,  G07C5/00 ,  B60T8/171 ,  B60T8/1755 ,  G01P15/18

CPC classification number: G07C5/00 ,  B60T8/171 ,  B60T8/1755 ,  B60T2270/413 ,  G01P15/18

Abstract: A combination sensor module for a vehicle, having at least two sensor submodules which are situated in the combination sensor module and able to be connected to the electronics system of the vehicle, wherein the at least two sensor submodules are able to be operated independently of each other.

Abstract translation: 一种用于车辆的组合传感器模块，具有至少两个传感器子模块，所述至少两个传感器子模块位于所述组合传感器模块中并能够连接到所述车辆的电子系统，其中所述至少两个传感器子模块能够独立于每个 其他。

公开(公告)号：US10317211B2

公开(公告)日：2019-06-11

申请号：US15108414

申请日：2014-12-30

Applicant: Robert Bosch GmbH ,  Bongsang Kim ,  Ando Feyh ,  Andrew Graham ,  Gary O'Brien ,  Michael Baus ,  Ralf Maier ,  Mariusz Koc

Inventor： Bongsang Kim ,  Ando Feyh ,  Andrew Graham ,  Gary O'Brien ,  Michael Baus ,  Ralf Maier ,  Mariusz Koc

IPC: G01P1/02 ,  G01C19/5769 ,  G01P15/08 ,  G01D5/241 ,  G01P1/00 ,  G01P15/18

Abstract: In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

公开(公告)号：US20140081477A1

公开(公告)日：2014-03-20

申请号：US14000063

申请日：2011-12-22

Applicant: Matthias Marcus Wellhoefer ,  Mariusz Koc

Inventor： Matthias Marcus Wellhoefer ,  Mariusz Koc

IPC: G07C5/00

CPC classification number: G07C5/00 ,  B60T8/171 ,  B60T8/1755 ,  B60T2270/413 ,  G01P15/18

Abstract: A combination sensor module for a vehicle, having at least two sensor submodules which are situated in the combination sensor module and able to be connected to the electronics system of the vehicle, wherein the at least two sensor submodules are able to be operated independently of each other.

Abstract translation: 一种用于车辆的组合传感器模块，具有至少两个传感器子模块，所述至少两个传感器子模块位于所述组合传感器模块中并能够连接到所述车辆的电子系统，其中所述至少两个传感器子模块能够独立于每个 其他。

公开(公告)号：US20130008250A1

公开(公告)日：2013-01-10

申请号：US13521904

申请日：2010-12-06

Applicant: Mariusz Koc ,  Ralf Schober

Inventor： Mariusz Koc ,  Ralf Schober

IPC: G01D11/10 ,  H05K13/00 ,  H05K7/00 ,  G01P1/02

CPC classification number: G01D11/30 ,  G01C19/5783 ,  G01P1/023 ,  Y10T29/49002

Abstract: A substrate material having a mechanical filtering characteristic, the substrate material having at least one support region for supporting the substrate material. In addition, the substrate material includes a sensor region having sensor terminal contacts. Furthermore, the substrate material includes a separating region, which is coupled to the at least one support region and the sensor region and is situated between the at least one support region and the sensor region. In this context, the substrate material in the separating region has a structure different from the substrate material in the support region and/or in the sensor region, in order to form a mechanical filtering characteristic.

Abstract translation: 一种具有机械滤波特性的基底材料，所述基底材料具有至少一个用于支撑基底材料的支撑区域。 此外，基板材料包括具有传感器端子触点的传感器区域。 此外，衬底材料包括分离区域，其分离至少一个支撑区域和传感器区域，并且位于至少一个支撑区域和传感器区域之间。 在本文中，为了形成机械滤波特性，分离区域中的基板材料具有与支撑区域和/或传感器区域中的基板材料不同的结构。