Invention Grant
- Patent Title: Semiconductor device and a method of fabricating the same
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Application No.: US15591031Application Date: 2017-05-09
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Publication No.: US10332875B2Publication Date: 2019-06-25
- Inventor: Tzu-Ping Chen , Chien-Hung Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW106111597A 20170406
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L27/06 ; H01L21/285 ; H01L21/311 ; H01L21/28 ; H01L29/423 ; H01L29/66 ; H01L27/11541 ; H01L27/11543

Abstract:
A semiconductor device includes a semiconductor substrate, a tunnel dielectric disposed on the semiconductor substrate, a floating gate disposed on the tunnel dielectric, a control gate disposed on the floating gate, and an insulation layer disposed between the floating gate and the control gate. The semiconductor device further includes a spacer continuously distributed on the sidewall surfaces of the floating gate and the control gate, and the spacer overlaps portions of the top surface of the floating gate.
Public/Granted literature
- US20180294359A1 SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME Public/Granted day:2018-10-11
Information query
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