Invention Grant
- Patent Title: Trench gate structure and manufacturing method therefor
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Application No.: US16064550Application Date: 2017-04-27
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Publication No.: US10347730B2Publication Date: 2019-07-09
- Inventor: Zheng Bian
- Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee Address: CN Jiangsu
- Agency: Polsinelli PC
- Priority: CN201610457601 20160622
- International Application: PCT/CN2017/082123 WO 20170427
- International Announcement: WO2017/219755 WO 20171228
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L21/768 ; H01L21/033

Abstract:
A trench gate structure and a manufacturing method therefor. The trench structure comprises a substrate (10), a trench on the surface of the substrate (10), an insulating spacer (20) on the substrate (10), a gate oxide layer (41) on the inner surface of the trench, and a polysilicon gate (40) on the gate oxide layer (41). The insulating spacer (20) abuts against the trench by means of a slope structure (21) of the insulating spacer; the polysilicon gate (40) extends onto the insulating spacer (20) along the slope structure (21) in the trench; the insulating spacer (20) comprises a polysilicon gate pull-up area (22) that is concave downwards with respect to other parts of the insulating spacer (20); the polysilicon gate (40) extending out of the trench is rested on the polysilicon gate pull-up area (22).
Public/Granted literature
- US20180374925A1 TRENCH GATE STRUCTURE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2018-12-27
Information query
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