Invention Grant
- Patent Title: Method for producing plated material, and plated material
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Application No.: US15028051Application Date: 2014-04-16
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Publication No.: US10351965B2Publication Date: 2019-07-16
- Inventor: Hiroyoshi Takahashi
- Applicant: Oriental Electro Plating Corporation
- Applicant Address: JP Kobe-shi, Hyogo
- Assignee: Oriental Electro Plating Corporation
- Current Assignee: Oriental Electro Plating Corporation
- Current Assignee Address: JP Kobe-shi, Hyogo
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2013-131317 20130624; JP2013-238010 20131118; JP2014-051824 20140314
- International Application: PCT/JP2014/002169 WO 20140416
- International Announcement: WO2014/207975 WO 20141231
- Main IPC: C25D5/50
- IPC: C25D5/50 ; C25D5/12 ; H01R13/03 ; C25D3/12 ; C25D3/40 ; C25D3/46 ; C25D3/48 ; C25D3/50 ; C25D5/48 ; C25F1/00 ; C25F5/00 ; C25D3/30

Abstract:
Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.
Public/Granted literature
- US20160348260A1 METHOD FOR MANUFACTURING PLATED MATERIAL AND PLATED MATERIAL Public/Granted day:2016-12-01
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