公开(公告)号：US10351965B2

公开(公告)日：2019-07-16

申请号：US15028051

申请日：2014-04-16

Applicant: Oriental Electro Plating Corporation

Inventor： Hiroyoshi Takahashi

IPC: C25D5/50 ,  C25D5/12 ,  H01R13/03 ,  C25D3/12 ,  C25D3/40 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/48 ,  C25F1/00 ,  C25F5/00 ,  C25D3/30

Abstract: Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

公开(公告)号：US09680246B2

公开(公告)日：2017-06-13

申请号：US15027778

申请日：2014-04-16

Applicant: Oriental Electro Plating Corporation

Inventor： Hiroyoshi Takahashi

IPC: H01R13/03 ,  C25D5/12 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/14 ,  C25D5/34 ,  H01R43/16 ,  C25D5/50

CPC classification number: H01R13/03 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/12 ,  C25D5/14 ,  C25D5/34 ,  C25D5/50 ,  H01R43/16

Abstract: A tin-plated/silver-plated laminate which has excellent abrasion resistance, electrical conductivity and slidability and a low frictional property is provided, which prevents the embrittlement of a plating layer contained therein. A method for producing the laminate involves forming a silver plating layer on a tin plating layer that is formed on the surface of a metallic base material by subjecting an arbitrary region in the surface of a tin plating layer to a nickel plating treatment to form a nickel plating layer; subjecting an arbitrary region in the surface of the nickel plating layer to a silver strike plating treatment; and subjecting at least a part of the surface region of the nickel plating layer, which has been subjected to the silver strike plating treatment, to a silver plating treatment.