Invention Grant
- Patent Title: Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
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Application No.: US14325758Application Date: 2014-07-08
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Publication No.: US10352691B1Publication Date: 2019-07-16
- Inventor: Haiguang Chen , Jaydeep Sinha , Shouhong Tang , Sergey Kamensky
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G01B9/02
Abstract:
Systems and methods for processing phase maps acquired using interferometer wafer geometry tools are disclosed. More specifically, instead of performing phase unwrapping first and then analyze the unwrapped data in a height domain, systems and methods in accordance with the present disclosure operate in a curvature domain without having to perform any phase unwrapping.
Information query
