Plasma generation and control using a DC ring
Abstract:
The present invention provides a SWP (surface wave plasma) processing system that does not create underdense conditions when operating at low microwave power and high gas pressure, thereby achieving a larger process window. The DC ring subsystem can be used to adjust the edge to central plasma density ratio to achieve uniformity control in the SWP processing system.
Public/Granted literature
Information query
Patent Agency Ranking
0/0