Invention Grant
- Patent Title: Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module
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Application No.: US16003782Application Date: 2018-06-08
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Publication No.: US10355171B2Publication Date: 2019-07-16
- Inventor: Jong Hyeon Chae , Jong Min Jang , Won Young Roh , Dae Woong Suh , Min Woo Kang , Joon Sub Lee , Hyun A Kim
- Applicant: Seoul Viosys Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Viosys Co., Ltd.
- Current Assignee: Seoul Viosys Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2012-0070129 20120628
- Main IPC: H01L33/40
- IPC: H01L33/40 ; H01L33/44 ; H01L33/46 ; H01L33/00 ; H01L33/48 ; H01L33/60 ; H01L33/62 ; H01L33/12 ; H01L33/06 ; H01L33/32 ; H01L33/20 ; H01L33/38

Abstract:
A light emitting diode including a first conductive type semiconductor layer; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; an electrode disposed on the mesa and configured to be in ohmic-contact with the corresponding second conductive type semiconductor layer of the mesa, a current spreading layer disposed on the mesa and the electrode and including a first portion, a second portion, and a third portion configured to be in ohmic-contact with a first end portion, a second end portion, and a middle portion of the first conductive type semiconductor layer, respectively, an insulation layer disposed on the mesa and the first conductive type semiconductor layer and having a first region having a thickness that varies along a longitudinal direction of the first semiconductor layer.
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