Invention Grant
- Patent Title: Solid-state imaging device and method of producing solid-state imaging device
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Application No.: US15835791Application Date: 2017-12-08
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Publication No.: US10361242B2Publication Date: 2019-07-23
- Inventor: Itaru Oshiyama , Yuki Miyanami , Susumu Hiyama , Kazuki Tanaka
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2008-231780 20080910
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A solid-state imaging device includes a sensor including an impurity diffusion layer provided in a surface layer of a semiconductor substrate; and an oxide insulating film containing carbon, the oxide insulating film being provided on the sensor.
Public/Granted literature
- US20180175099A1 SOLID-STATE IMAGING DEVICE AND METHOD OF PRODUCING SOLID-STATE IMAGING DEVICE Public/Granted day:2018-06-21
Information query
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