An integrated circuit (IC) package with improved performance and reliability is disclosed. The IC package includes an IC die and a routing structure. The IC die includes a conductive via having a peripheral edge. The routing structure includes a conductive structure coupled to the conductive via. The conductive structure may include a cap region, a routing region, and an intermediate region. The cap region may overlap an area of the conductive via. The routing region may have a first width and the intermediate region may have a second width along the peripheral edge of the conductive via, where the second width may be greater than the first width. The intermediate region may be arranged to connect the cap region to the routing region.