Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15966231Application Date: 2018-04-30
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Publication No.: US10367005B2Publication Date: 2019-07-30
- Inventor: Shunpei Yamazaki , Yuta Endo , Kiyoshi Kato , Satoru Okamoto
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2016-024794 20160212
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/02 ; H01L21/768 ; H01L23/528 ; H01L23/532 ; H01L27/105 ; H01L29/24 ; H01L29/66 ; H01L29/786 ; H01L21/8258 ; H01L27/06 ; H01L21/3105 ; H01L21/3115 ; H01L27/088 ; H01L27/092

Abstract:
A highly reliable semiconductor device suitable for miniaturization and high integration is provided. The semiconductor device includes a first insulator; a transistor over the first insulator; a second insulator over the transistor; a first conductor embedded in an opening in the second insulator; a barrier layer over the first conductor; a third insulator over the second insulator and over the barrier layer; and a second conductor over the third insulator. The first insulator, the third insulator, and the barrier layer have a barrier property against oxygen and hydrogen. The second insulator includes an excess-oxygen region. The transistor includes an oxide semiconductor. The barrier layer, the third insulator, and the second conductor function as a capacitor.
Public/Granted literature
- US20180254291A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-09-06
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