- Patent Title: Semiconductor devices and FinFET devices having shielding layers
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Application No.: US15876223Application Date: 2018-01-22
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Publication No.: US10367078B2Publication Date: 2019-07-30
- Inventor: Chia-Yuan Chang , Che-Hao Chang , Cheng-Hao Hou , Kuei-Lun Lin , Kun-Yu Lee , Xiong-Fei Yu , Chi-On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/51 ; H01L29/66 ; H01L29/78 ; H01L21/02 ; H01L21/28

Abstract:
Semiconductor devices, FinFET devices and methods of forming the same are disclosed. One of the semiconductor devices includes a substrate and a gate structure over the substrate. The gate structure includes a high-k layer over the substrate, a shielding layer over the high-k layer, and an N-type work function metal layer over the shielding layer. In some embodiments, the shielding layer has a dielectric constant less than a dielectric constant of the high-k layer.
Public/Granted literature
- US20190140082A1 SEMICONDUCTOR DEVICES, FINFET DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2019-05-09
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