Invention Grant
- Patent Title: Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device
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Application No.: US15167570Application Date: 2016-05-27
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Publication No.: US10374134B2Publication Date: 2019-08-06
- Inventor: Tadao Hayashi , Teruhito Azuma , Suguru Beppu , Kunihiro Izuno , Tsuyoshi Okahisa
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2015-109807 20150529; JP2016-031940 20160223
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/48 ; H01L33/58 ; H01L33/60

Abstract:
A light emitting device includes: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element. The light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of a lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element.
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