Light emitting device and method of manufacturing same

    公开(公告)号:US10985298B2

    公开(公告)日:2021-04-20

    申请号:US16109177

    申请日:2018-08-22

    Inventor: Tadao Hayashi

    Abstract: A light emitting device including a light emitting element, a light transmissive member, a light guide member, and a light reflective member. The light transmissive member is disposed on an upper surface of the light emitting element, and has a lower surface including a first region facing the light emitting element and a second region positioned outside of the first region. The light guide member covers a lateral surface of the light emitting element and the second region of the lower surface of the light transmissive member. The light reflective member covers the light emitting element, an upper surface of the light transmissive member and the light guide member. One of lateral surfaces of the light transmissive member is exposed from the light reflective member.

    Lighting device and method for manufacturing the same

    公开(公告)号:US10001594B2

    公开(公告)日:2018-06-19

    申请号:US15281402

    申请日:2016-09-30

    Inventor: Tadao Hayashi

    Abstract: A lighting device includes a light-emitting component including at least one light-emitting element mounted on a base, a light guide plate guiding light emitted from the light-emitting element, a wavelength conversion member partially covering the light guide plate, and a first reflective member covering the wavelength conversion member. The light guide plate comprises two main surfaces, which include a light-extraction surface allowing light emitted from the light-emitting element to exit and a rear surface opposite to the light-extraction surface. One of two main surfaces comprises at least one recess formed in an edge region thereof. The other main surface of the light guide plate includes a part covered by the wavelength conversion member and a part exposed from the wavelength conversion member. The light-emitting element is accommodated in the recess such that a light-emitting surface of the light-emitting element faces the wavelength conversion member.

    Semiconductor light-emitting apparatus and method of fabricating the same
    4.
    发明授权
    Semiconductor light-emitting apparatus and method of fabricating the same 有权
    半导体发光装置及其制造方法

    公开(公告)号:US08735934B2

    公开(公告)日:2014-05-27

    申请号:US14083477

    申请日:2013-11-19

    Abstract: A light-emitting apparatus has a light-emitting device and a supporting board. The light-emitting device has a pair of n-electrodes with a p-electrode therebetween, on the same plane. The supporting board includes an insulating substrate on which positive and negative electrodes are formed, opposing to the p- and n-electrodes of the light-emitting device, respectively. Bonding members bond the p- and n-electrodes with the positive and negative electrodes, respectively. The positive electrode on the supporting board is formed within the width region of the p-electrode and narrower in width than the width of the p-electrode, in a cross-section along a line extending through the pair of n-electrodes. The negative electrodes oppose to the n-electrodes, respectively, with the same widths, or with that side face of each of the negative electrodes which faces the positive electrode being retracted outwardly from that side face of each of the n-electrodes which faces the p-electrode.

    Abstract translation: 发光装置具有发光装置和支撑基板。 发光装置在同一平面上具有一对具有p电极的n电极。 支撑板包括分别与发光器件的p电极和n电极相对形成有正极和负极的绝缘基板。 接合部件分别将p电极和n电极与正电极和负电极接合。 沿着延伸穿过该对n电极的线的横截面,支撑板上的正电极形成在p电极的宽度区域内并且宽度比p电极的宽度窄。 负电极分别以相同的宽度与n电极相对,或者与面对正电极的每个负电极的侧面从面向每个n电极的每个n电极的侧面向外缩回 p电极。

    Semiconductor light-emitting apparatus and method of fabricating the same

    公开(公告)号:US08614109B2

    公开(公告)日:2013-12-24

    申请号:US13687106

    申请日:2012-11-28

    Abstract: A light-emitting apparatus has a light-emitting device and a supporting board. The light-emitting device has a pair of n-electrodes with a p-electrode therebetween, on the same plane. The supporting board includes an insulating substrate on which positive and negative electrodes are formed, opposing to the p- and n-electrodes of the light-emitting device, respectively. Bonding members bond the p- and n-electrodes with the positive and negative electrodes, respectively. The positive electrode on the supporting board is formed within the width region of the p-electrode and narrower in width than the width of the p-electrode, in a cross-section along a line extending through the pair of n-electrodes. The negative electrodes oppose to the n-electrodes, respectively, with the same widths, or with that side face of each of the negative electrodes which faces the positive electrode being retracted outwardly from that side face of each of the n-electrodes which faces the p-electrode.

    Light emitting device including covering member and optical member

    公开(公告)号:US11329203B2

    公开(公告)日:2022-05-10

    申请号:US16022476

    申请日:2018-06-28

    Inventor: Tadao Hayashi

    Abstract: A light emitting device includes: a light emitting element comprising: a semiconductor multilayer structure that has an electrode formation surface, a light-emitting surface opposite to the electrode formation surface, and side surfaces between the electrode formation surface and the light-emitting surface, and a pair of electrodes provided on the electrode formation surface; a covering member covering the side surfaces of the light emitting element; and an optical member disposed over the light-emitting surface of the light emitting element and an upper surface of the covering member, the optical member comprising: a light-reflective portion disposed above the light emitting element, and a light-transmissive portion disposed between the light-reflective portion and the covering member and forming a part of an outer side surface of the light emitting device.

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