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    Light emitting device
    1.
    发明授权
    Light emitting device 有权

    公开(公告)号：US11056627B2

    公开(公告)日：2021-07-06

    申请号：US16784387

    申请日：2020-02-07

    Applicant: NICHIA CORPORATION

    Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

    IPC: H01L33/60 ,  H01L33/50 ,  H01L21/3213

    Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

    Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device
    6.
    发明授权
    Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device 有权

    公开(公告)号：US10374134B2

    公开(公告)日：2019-08-06

    申请号：US15167570

    申请日：2016-05-27

    Applicant: NICHIA CORPORATION

    Inventor： Tadao Hayashi ,  Teruhito Azuma ,  Suguru Beppu ,  Kunihiro Izuno ,  Tsuyoshi Okahisa

    IPC: H01L33/50 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60

    Abstract: A light emitting device includes: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element. The light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of a lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element.

    Method of manufacturing light-emitting device including phosphor pieces
    8.
    发明授权
    Method of manufacturing light-emitting device including phosphor pieces 有权

    公开(公告)号：US11978822B2

    公开(公告)日：2024-05-07

    申请号：US17511049

    申请日：2021-10-26

    Applicant: NICHIA CORPORATION

    Inventor： Suguru Beppu

    IPC: H01L33/00 ,  H01L21/66 ,  H01L33/50

    CPC classification number: H01L33/0062 ,  H01L22/12 ,  H01L33/504

    Abstract: A method of manufacturing a light-emitting device 1 includes a step of providing first phosphor sheets 11, a step of providing second phosphor sheets 12, a step of providing a light-emitting element 13, a selection step of selecting a combination of one of the first phosphor sheets 11 and one of the second phosphor sheets 12 on the basis of a wavelength conversion characteristic of each of the first phosphor sheets 11 and a wavelength conversion characteristic of each of the second phosphor sheets 12, a step of obtaining a plurality of first phosphor pieces 11c and a plurality of second phosphor pieces 12c from the selected first phosphor sheet 11 and the selected second phosphor sheet 12, and a step of disposing one of the first phosphor pieces 11c and one of the second phosphor pieces 12c on or above the light-emitting element 13.

    Light emitting device and method for producing the same
    9.
    发明授权
    Light emitting device and method for producing the same 有权

    公开(公告)号：US10193036B2

    公开(公告)日：2019-01-29

    申请号：US15879812

    申请日：2018-01-25

    Applicant: NICHIA CORPORATION

    Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

    IPC: H01L33/60 ,  H01L33/50

    Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

    Method of producing light emitting device
    10.
    发明授权
    Method of producing light emitting device 有权
    制造发光器件的方法

    公开(公告)号：US09461219B2

    公开(公告)日：2016-10-04

    申请号：US14718292

    申请日：2015-05-21

    Applicant: NICHIA CORPORATION

    Inventor： Takeshi Ikegami ,  Suguru Beppu ,  Tatsuya Kanazawa ,  Yoichi Bando

    IPC: H01L33/58 ,  H01L33/56 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

    CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/0058

    Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

    Abstract translation: 一种制造发光器件的方法包括在基底构件上设置发光元件，所述基底构件至少在其上表面上包括绝缘构件和一对连接端子。 连接端子具有暴露于外部的暴露部分，其中发光元件电连接到连接端子。 覆盖构件设置成覆盖发光元件的上表面的至少一部分，并且设置保护层以覆盖连接端子的暴露部分的至少一部分。 除去覆盖部件，从基材的上表面侧供给材料，在发光元件的上表面设置透光性部件。 然后去除保护层上存在的透光部件的至少一部分。

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