Invention Grant
- Patent Title: Light converter assemblies with enhanced heat dissipation
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Application No.: US15118075Application Date: 2015-03-10
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Publication No.: US10374137B2Publication Date: 2019-08-06
- Inventor: Maria Anc , Alan Lenef
- Applicant: OSRAM GmbH , OSRAM Opto Semiconductors GmbH
- Applicant Address: DE München DE Regensburg
- Assignee: OSRAM GmbH,OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM GmbH,OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE München DE Regensburg
- Agency: Slater Matsil, LLP
- International Application: PCT/US2015/019762 WO 20150310
- International Announcement: WO2015/138495 WO 20150917
- Main IPC: H01L33/50
- IPC: H01L33/50 ; B32B3/02 ; B32B3/10 ; B32B3/24 ; B32B7/027 ; B32B7/04 ; C04B35/115 ; F21K9/64 ; H01L33/64 ; F21Y115/30 ; F21V29/83 ; B32B15/04 ; B32B18/00 ; B32B3/26 ; B32B7/12 ; B32B15/20

Abstract:
The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. The first substrate may be hermetically sealed to a second substrate using the confinement material so that the phosphor material is confined between the substrates and protected from atmospheric contamination. The substrates may comprise, for example, sapphire to allow for light beam transmission and heat conductance. Confinement materials that may be employed to seal the first substrate to the second substrate may include, for example, silicon or a metal (e.g., silver, copper, aluminum, etc.) The phosphor material may comprise, for example, at least one quantum dot material.
Public/Granted literature
- US20160369954A1 LIGHT CONVERTER ASSEMBLIES WITH ENHANCED HEAT DISSIPATION Public/Granted day:2016-12-22
Information query
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