Invention Grant
- Patent Title: Leadless stack comprising multiple components
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Application No.: US15670247Application Date: 2017-08-07
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Publication No.: US10381162B2Publication Date: 2019-08-13
- Inventor: John E. McConnell , Garry L. Renner , John Bultitude , R. Allen Hill , Galen W. Miller
- Applicant: KEMET Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Patent Filing Specialist, Inc.
- Agent Joseph T. Guy
- Main IPC: H01G4/40
- IPC: H01G4/40 ; H01G4/232 ; H01G4/38 ; H01G4/248 ; H01G4/30 ; H01G4/002 ; B23K35/36 ; B23K20/00 ; B23K20/02 ; B23K20/16 ; B23K20/22 ; B23K35/02 ; H01G4/012 ; H01G4/12 ; B22F3/10 ; H01G4/008 ; B23K101/40 ; B23K101/42
Abstract:
An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.
Public/Granted literature
- US20170358397A1 Leadless Stack Comprising Multiple Components Public/Granted day:2017-12-14
Information query
