公开(公告)号：US20150036263A1

公开(公告)日：2015-02-05

申请号：US14498514

申请日：2014-09-26

Applicant: Kemet Electronics Corporation

Inventor： R. Allen Hill ,  Philip M. Lessner ,  Reggie Phillips ,  Keith Brown ,  James B. Byrd

IPC: H01G2/06 ,  H01G4/008 ,  H01G4/30

CPC classification number: H01G2/06 ,  H01G4/008 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/43

Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

Abstract translation: 描述了具有改进的引线框架附件的电容器，其中改进的引线框架附件减轻了缺陷。 电容器包括具有交替极性的平行导电内部电极与导电内部电极之间的电介质。 第一铜底涂层与第一极性的导电内部电极电接触，并且第二铜底涂层与第二极性的导电内部电极电接触。 第一引线与第一铜底涂层电接触，在第一引线和第一铜底涂层之间具有第一焊料。 第二引线与第二铜底涂层电接触，在第二引线和第二铜底涂层之间具有第二焊料。

公开(公告)号：US20190318877A1

公开(公告)日：2019-10-17

申请号：US16456912

申请日：2019-06-28

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  R. Allen Hill ,  Galen W. Miller

IPC: H01G4/40 ,  H01G4/38 ,  H01G4/30 ,  H01G4/002 ,  B23K20/16 ,  B23K20/02 ,  B23K35/02 ,  H01G4/232 ,  B23K20/00 ,  B23K35/36 ,  B23K20/22

Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements

公开(公告)号：US10381162B2

公开(公告)日：2019-08-13

申请号：US15670247

申请日：2017-08-07

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  R. Allen Hill ,  Galen W. Miller

IPC: H01G4/40 ,  H01G4/232 ,  H01G4/38 ,  H01G4/248 ,  H01G4/30 ,  H01G4/002 ,  B23K35/36 ,  B23K20/00 ,  B23K20/02 ,  B23K20/16 ,  B23K20/22 ,  B23K35/02 ,  H01G4/012 ,  H01G4/12 ,  B22F3/10 ,  H01G4/008 ,  B23K101/40 ,  B23K101/42

Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.

公开(公告)号：US09799449B2

公开(公告)日：2017-10-24

申请号：US14498514

申请日：2014-09-26

Applicant: Kemet Electronics Corporation

Inventor： R. Allen Hill ,  Philip M. Lessner ,  Reggie Phillips ,  Keith Brown ,  James B. Byrd

IPC: H01G2/06 ,  H01G4/008 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G2/06 ,  H01G4/008 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/43

Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

公开(公告)号：US10790094B2

公开(公告)日：2020-09-29

申请号：US16456912

申请日：2019-06-28

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  R. Allen Hill ,  Galen W. Miller

IPC: H01G4/40 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002 ,  H01G4/38 ,  B23K35/36 ,  B23K20/00 ,  B23K20/02 ,  B23K20/16 ,  B23K20/22 ,  B23K35/02 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12 ,  B22F3/10 ,  H01G4/008 ,  B23K101/40 ,  B23K101/42

Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.

公开(公告)号：US20170358397A1

公开(公告)日：2017-12-14

申请号：US15670247

申请日：2017-08-07

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  R. Allen Hill ,  Galen W. Miller

IPC: H01G4/40 ,  H01G4/002 ,  H01G4/30 ,  H01G4/38 ,  H01G4/232 ,  H01G4/012 ,  H01G4/248 ,  B22F3/10 ,  H01G4/12

CPC classification number: H01G4/40 ,  B22F3/1035 ,  B23K20/002 ,  B23K20/026 ,  B23K20/16 ,  B23K20/22 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01G4/002 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01G4/38 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements

公开(公告)号：US20140123453A1

公开(公告)日：2014-05-08

申请号：US14152389

申请日：2014-01-10

Applicant: Kemet Electronics Corporation

Inventor： Maurice Perea ,  R. Allen Hill ,  Reggie Phillips

IPC: H01G4/30

CPC classification number: H01G4/30 ,  H01C1/014 ,  H01C1/14 ,  H01G4/232 ,  Y10T29/417 ,  Y10T29/43

Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.

Abstract translation: 一种形成层叠电子元件的方法，以及通过该方法形成的电子部件，其中该方法包括：提供多个电子部件，其中每个电子部件包括第一外部端接和第二外部端接; 提供第一引线框架板和第二引线框架板，其中第一引线框架板和第二引线框架板包括倒钩和引线; 提供包括空腔和底部的模制外壳; 以及在所述第一引线框架板和所述第二引线框架板之间以阵列形式形成电子部件的夹层，所述倒钩朝向所述电子部件突出并且所述引线延伸穿过所述底部。