发明授权
- 专利标题: Embedded junction in hetero-structured back-surface field for photovoltaic devices
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申请号: US15966864申请日: 2018-04-30
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公开(公告)号: US10388815B2公开(公告)日: 2019-08-20
- 发明人: Tze-Chiang Chen , Bahman Hekmatshoartabari , Devendra K. Sadana , Davood Shahrjerdi
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Tutunjian & Bitetto, P.C.
- 代理商 Erik Johnson
- 主分类号: H01L31/18
- IPC分类号: H01L31/18 ; H01L31/056 ; H01L31/068 ; H01L31/0224 ; H01L31/0747
摘要:
A photovoltaic device and method include a crystalline substrate and an emitter contact portion formed in contact with the substrate. A back-surface-field junction includes a homogeneous junction layer formed in contact with the crystalline substrate and having a same conductivity type and a higher active doping density than that of the substrate. The homogeneous junction layer includes a thickness less than a diffusion length of minority carriers in the homogeneous junction layer. A passivation layer is formed in contact with the homogeneous junction layer opposite the substrate, which is either undoped or has the same conductivity type as that of the substrate.
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