Invention Grant
- Patent Title: Dielectric metal oxide cap for channel containing germanium
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Application No.: US15776752Application Date: 2015-12-24
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Publication No.: US10403733B2Publication Date: 2019-09-03
- Inventor: Gilbert Dewey , Ashish Agrawal , Benjamin Chu-Kung , Van H. Le , Matthew V. Metz , Willy Rachmady , Jack T. Kavalieros , Rafael Rios
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2015/000500 WO 20151224
- International Announcement: WO2017/111872 WO 20170629
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/51 ; H01L29/78 ; H01L29/16 ; H01L29/66

Abstract:
Embodiments of the present disclosure describe semiconductor devices comprised of a semiconductor substrate with a metal oxide semiconductor field effect transistor having a channel including germanium or silicon-germanium, where a dielectric layer is coupled to the channel. The dielectric layer may include a metal oxide and at least one additional element, where the at least one additional element may increase a band gap of the dielectric layer. A gate electrode may be coupled to the dielectric layer. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20180374928A1 DIELECTRIC METAL OXIDE CAP FOR CHANNEL CONTAINING GERMANIUM Public/Granted day:2018-12-27
Information query
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