Invention Grant
- Patent Title: Substrate processing device and substrate processing method
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Application No.: US15608554Application Date: 2017-05-30
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Publication No.: US10406566B2Publication Date: 2019-09-10
- Inventor: Jun Matsushita , Yuji Nagashima , Konosuke Hayashi , Kunihiro Miyazaki
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-Shi, Kanagawa
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama-Shi, Kanagawa
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-205172 20130930; JP2014-141828 20140709
- Main IPC: B08B3/08
- IPC: B08B3/08 ; H01L21/67 ; B08B3/02
Abstract:
A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.
Public/Granted literature
- US20170259308A1 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-09-14
Information query
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