Invention Grant
- Patent Title: Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the same
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Application No.: US15602185Application Date: 2017-05-23
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Publication No.: US10411062B2Publication Date: 2019-09-10
- Inventor: Jun Hyung Kim , Seokho Kim , SungHyup Kim , Jaegeun Kim , Taeyeong Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0145375 20161102
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; H01L23/00 ; H01L27/146 ; H01L21/20
Abstract:
Disclosed are a substrate bonding apparatus and a method of manufacturing a semiconductor device. The substrate bonding apparatus comprises vacuum pumps, a first chuck engaged with the vacuum pumps and adsorbing a first substrate at vacuum pressure of the vacuum pumps, and a pushing unit penetrating a center of the first chuck and pushing the first substrate away from the first chuck. The first chuck comprises adsorption sectors providing different vacuum pressures in an azimuth direction to the first substrate.
Public/Granted literature
- US20180122845A1 SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2018-05-03
Information query
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