- 专利标题: Semiconductor device and method for manufacturing semiconductor device
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申请号: US16019190申请日: 2018-06-26
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公开(公告)号: US10411105B2公开(公告)日: 2019-09-10
- 发明人: Akihiro Hikasa , Kazusuke Kato
- 申请人: ROHM CO., LTD. , LAPIS Semiconductor Co., Ltd.
- 申请人地址: JP Kyoto JP Kanagawa
- 专利权人: ROHM CO., LTD.,LAPIS SEMICONDUCTOR CO., LTD.
- 当前专利权人: ROHM CO., LTD.,LAPIS SEMICONDUCTOR CO., LTD.
- 当前专利权人地址: JP Kyoto JP Kanagawa
- 代理机构: Hamre, Schumann, Mueller & Larson, P.C.
- 优先权: JP2016-014560 20160128
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L29/45 ; H01L21/02 ; H01L21/04 ; H01L21/3205 ; H01L21/3213 ; H01L29/16 ; H01L29/732 ; H01L29/739 ; H01L29/78 ; H01L29/861 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/06 ; H01L23/532
摘要:
A semiconductor device according to the present invention includes: a semiconductor layer including a first conductivity type semiconductor region and a second conductivity type semiconductor region joined to the first conductivity type semiconductor region; and a surface electrode connected to the second conductivity type region on one surface of the semiconductor layer, including a first Al-based electrode, a second Al-based electrode, an Al-based oxide film interposed between the first Al-based electrode and the second Al-based electrode, and a plated layer on the second Al-based electrode.
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