- 专利标题： Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
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申请号： US15774937申请日： 2015-12-11
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公开(公告)号： US10418329B2公开(公告)日： 2019-09-17
- 发明人: Eric J. Li , Timothy A. Gosselin , Yoshihiro Tomita , Shawna M. Liff , Amram Eitan , Mark Saltas
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Green, Howard & Mughal LLP.
- 国际申请： PCT/US2015/065165 WO 20151211
- 国际公布： WO2017/099788 WO 20170615
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/48 ; H01L23/13 ; H01L21/56 ; H01L23/00 ; H01L25/065 ; H01L21/48 ; H01L23/31
摘要：
A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
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