Invention Grant
- Patent Title: Abrasive particle-dispersion layer composite and polishing slurry composition including the same
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Application No.: US15386502Application Date: 2016-12-21
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Publication No.: US10421883B2Publication Date: 2019-09-24
- Inventor: Jang Kuk Kwon , Sung Pyo Lee , Chang Gil Kwon , Jun Ha Hwang
- Applicant: KCTECH CO., LTD.
- Applicant Address: KR Anseong-si
- Assignee: KCTECH CO., LTD.
- Current Assignee: KCTECH CO., LTD.
- Current Assignee Address: KR Anseong-si
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: KR10-2015-0186156 20151224
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09G1/04 ; C09K3/14 ; H01L21/304 ; H01L21/3105 ; H01L21/321

Abstract:
An abrasive particle-dispersion layer composite and a polishing slurry composition including the abrasive particle-dispersion layer composite are provided. The abrasive particle-dispersion layer composite includes abrasive particles, a first dispersant that is at least one cationic compound among an amino acid, an organic acid, polyalkylene glycol and a high-molecular polysaccharide coupled to a glucosamine compound, and a second dispersant that is a cationic polymer including at least two ionized cations in a molecular formula.
Public/Granted literature
- US20170183539A1 ABRASIVE PARTICLE-DISPERSION LAYER COMPOSITE AND POLISHING SLURRY COMPOSITION INCLUDING THE SAME Public/Granted day:2017-06-29
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